How are statutory periods calculated for holidays and weekends?

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Source: FAQ (MPEP-Based) BlueIron Update: 2024-09-10 10 Rules 5 Related FAQs This page is an FAQ based on guidance from the Manual of Patent Examining Procedure. It is provided as guidance, with links to the ground truth sources. This is information only: it is not legal advice. When calculating statutory periods for patent applications, holidays and weekends are handled as follows: If the last day of the period falls on a Saturday, Sunday, or federal holiday within the District of Columbia, the period is extended to the next day that is not a Saturday, Sunday, or federal holiday. This extension applies to deadlines for both the USPTO and applicants. As stated in MPEP 710.01(a) : “If the last day of the period for reply falls on a Saturday, Sunday, or federal holiday within the District of Columbia, the period for reply will be extended to the next succeeding secular or business day which is not a Saturday, Sunday, or federal holiday.” Related Rules from the Manual of Patent Examining Procedure 10 rules Collapse Extension Not Affected by Holiday MPEP 710.01(a) Permitted Abandonment Date Regardless of Holiday MPEP 710.01(a) Permitted Application Abandoned on June 1 if No Reply by May 31 MPEP 710.01(a) Permitted Application Abandoned for Missing Prosecution Within Six Months MPEP 710 Required Director May Extend Time for Taking Action on Important Inventions MPEP 710 Permitted Technology Center Director Decides Time Extensions MPEP 710 Reply to Office Action Due Dates MPEP 710.01(a) Permitted 1-Month Extension Extends Reply Date to Following Month MPEP 710.01(a) Extension of Reply Time for Office Action MPEP 710.01(a) 1-Month Reply Extension Due by May 31 MPEP 710.01(a) Permitted Other Related FAQs 5 FAQs Collapse What is the &#8216;next succeeding business day&#8217; rule for patent application deadlines? What happens if the statutory period for reply ends on a weekend or federal holiday? What should applicants know about recognizing reply due dates for patent applic...