Can I use hole-punched paper for my patent application?
Can I use hole-punched paper for my patent application?
No, you should not use hole-punched paper for your patent application. The USPTO has specific requirements regarding the paper used for patent applications, and hole-punched paper is explicitly prohibited.
As stated in MPEP 501: Holes should not be punched in the paper.
This requirement is in place to ensure that all documents can be properly scanned, stored, and processed by the USPTO without any loss of information or potential damage to the application papers. Using standard, unmarked paper without holes helps maintain the integrity of the document throughout the application process.
Topics:
MPEP 500 - Receipt and Handling of Mail and Papers,
MPEP 501 - Filing Papers With the U.S. Patent and Trademark Office,
Patent Law,
Patent Procedure