Can I use a different correspondence address for USPTO communications than the one on my DM/1 form?

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Source: FAQ (MPEP-Based) BlueIron Update: 2024-09-29 10 Rules 5 Related FAQs This page is an FAQ based on guidance from the Manual of Patent Examining Procedure. It is provided as guidance, with links to the ground truth sources. This is information only: it is not legal advice. Yes, you can specify a different correspondence address for USPTO communications than the one on your DM/1 form for an international design application. The MPEP 2912 states: “ Applicants may specify a different address than specified on the DM/1 form for the purpose of correspondence sent by the USPTO as an office of indirect filing. “ This means that while the DM/1 form includes items for specifying an address for correspondence with the International Bureau, you have the option to provide a separate address specifically for communications from the USPTO when it acts as an office of indirect filing. Related Rules from the Manual of Patent Examining Procedure 10 rules Collapse Specify Correspondence Address for International Design Applications MPEP 2912 Applicant May Specify Correspondence Address for USPTO MPEP 2912 Permitted Applicant May Specify Different Address for USPTO Correspondence MPEP 2912 Permitted Correspondence Address for Indirect Filing MPEP 2912 Permitted Correspondence Address for Nonprovisional International Design Application MPEP 2920.03 Correspondence Address for Nonprovisional International Design Application MPEP 2920.03 Office May Use Application Data for Correspondence Until Corrected MPEP 2912 Permitted Mailing Address for International Design Applications MPEP 2905.01 Recommended Transmittal of International Design Application to International Bureau MPEP 2905.01 Required Office May Use Customer Number Address Over Paper Address MPEP 2912 Permitted Other Related FAQs 5 FAQs Collapse What happens if no correspondence address is specified for an international design application? How can I specify a correspondence address for an international design application fil...